exposed pad in EQFP package

Hi,

I'm afraid, but I think the exposed Pad makes manual soldering of the EQFP impossible, this chip package requires either reflow soldering or vapour phase soldering (or a professional rework center). Soldering the exposed pad requires the package itself and the PCB to be heated up to the solder liquid temperature by a profile not exposing the die too long by too high temperatures. I did a lot soldering on the "good old" TQFP myself and thus I'm not really amused on the exposed Pad..

I did rework on smaller packages of switch-mode regulator with "pad on botttom" with heatgun, this physically soldered the device but I'm quite sure I shorted this device's lifetime by this temperature treatment...

CU, Carlhermann