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New ContributorEPM570F256I5 solder ball composition
Whether there have been any changes in the solder ball composition of the MAX II CPLD EPM570F256I5.
Hi Sir,
I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf
Thank You.
2 Replies
YuanLi_S_IntelRegular Contributor
Hi Sir,
I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf
Thank You.
SL10Thank you YuanLi_S_Intel for the fast response. The problem is resolved.
