Does Cyclone 3 FPGA have thermal protection?

Hi,

Under Package Information for Cyclone III Devices you can find the more information.

if your are using E144 packages,which is having an exposed pad at the bottom of the package.

This exposed pad is used for electrical connectivity and not for thermal purposes.

Most VCC and GND pins are located at the center of the package, the GND and VCC pins are located under the die.As a result, the heat generated in the device can be transferred out through the GND and VCC pins (i.e., the GND and VCC pins act as a heat sink).

You can have other options like

• pin-fin heat sink.
• motor-driven fan heat sink.

Check the Handbook & pin Connection Guidelines for more details.

Other useful threads

https://forums.intel.com/s/question/0D50P00003yyKYQSA2/maximum-power-dissipation

https://forums.intel.com/s/question/0D50P00003yyR77SAE/cyclone-iii-144-qfp-package-forgot-the-ground-pad-on-circuit-board

Let me know if this has helped resolve the issue you are facing or if you need any further assistance.

Best Regards,

Anand Raj Shankar

(This message was posted on behalf of Intel Corporation)