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Altera_Forum
Honored Contributor
10 years agoSh.t, it helped. I had small via almost at the center of the pad. I first used 0.5 mm drill to remove solder from it, then used 0.7 to increase its radius, then 2 mm and then 3 mm drill. 3 mm drill is obtuse drill - left from the cracked normal drill. So I drilled up to the pad, removing PCB internals first, then copper layer and mask, up to the white die of the chip. Then filled hole with solder at 440C, and connected with solder to the nearby capacitor's ground output. Ugly, but after first power up board started. I think next time I will do the same - make big via/metallized hole to fill at soldering time.
Pete, thank you so much for the solution.