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Altera_Forum's avatar
Altera_Forum
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15 years ago

BGA Bake Requirements

We use a 256-FBGA Altera device on our product, which is in turn a surface-mount device. Should there be any requirement to bake our parts prior to our customer's reflow (is there any risk of moisture absorbtion by the BGA package once it has been mounted to our board)?

:confused:

1 Reply

  • Altera_Forum's avatar
    Altera_Forum
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    15 years ago

    The requirements are printed on the packing bags, if I remember right. Most Altera devices have one week floor lifetime (unpacking until needing baking). Moisture absorption of the mounted devices can be an issue, if board rework is required. Then the baking procedure applies to the board, I think.