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Contributor

6 years ago

Solved

A10 FPGA allowed maximum Mechanical pressure when mounting heatsink?

Hi, we use A10 GX(10AX057H3F34E2SG) , FBGA package 1152 pins. Desinged ONE whole large heatsink mounted on the top of 3 pcs of A10. Power is 20 Watt for each one, and we use compressible thermal ...

YuanLi_S_Intel
6 years ago
Hi Yi Xiao,
Apologize that i share the wrong information. It should be SnAgCu. You may find the solder ball information at our package drawing.
https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_10
Regards,
YL

YuanLi_S_Intel

Regular Contributor

6 years ago

Hi Yi Xiao,

Yes, you can apply the information to all Intel FPGA.

https://www.intel.com/content/www/us/en/programmable/support/support-resources/knowledge-base/solutions/rd04172001_4367.html

For your device, Arria 10 (10AX057H3F34E2SG), it is using FBGA package with SnPB Solder ball.

Regards,

xytech

Contributor

6 years ago

Hi YL,

Where could we find the ball material information ?

Loacal Intel support tell me A10 use SAC (tin-silver-copper) solder balls, which is different from your answer. I am CONFUSED and not sure who is correct. Below is the screenshot of their email.

We also use 10CL055YU484C8G, UBGA 484 pins, and need to know its ball material type.

By the way, I thought all intel device comply to ROHS, SnPb seems to contain Pb......

Thanks.

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A10 FPGA allowed maximum Mechanical pressure when mounting heatsink?

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