Forum Discussion
ContributorA10 FPGA allowed maximum Mechanical pressure when mounting heatsink?
Hi Yi Xiao,
Apologize that i share the wrong information. It should be SnAgCu. You may find the solder ball information at our package drawing.
https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_10
Regards,
YL
Regular ContributorHi Yi Xiao,
Yes, you can apply the information to all Intel FPGA.
https://www.intel.com/content/www/us/en/programmable/support/support-resources/knowledge-base/solutions/rd04172001_4367.html
For your device, Arria 10 (10AX057H3F34E2SG), it is using FBGA package with SnPB Solder ball.
Regards,
YL
ContributorHi YL,
Where could we find the ball material information ?
Loacal Intel support tell me A10 use SAC (tin-silver-copper) solder balls, which is different from your answer. I am CONFUSED and not sure who is correct. Below is the screenshot of their email.
We also use 10CL055YU484C8G, UBGA 484 pins, and need to know its ball material type.
By the way, I thought all intel device comply to ROHS, SnPb seems to contain Pb......
Thanks.
