This is important case found IC Intel/Altera Stratix® III Devices Failure [MFG PN: EP3SL70F780C4NAB] Failure during ICT [In-Circuit Test] under IBM BU. The failure symptom is FPGA Power +3.3VE Load to GND.

Hello Wani,

Herewith below more additional the details per yours inquires.

Shall you expedite review and provide support with ERMA# and Shipping Instruction to drop return affect Stratix® III Devices Failure back to Intel/Altera Corporation perform the analysis ?

We got e-mail from your private message for return process BUT no attached file for shipping guidelines.

Appreciate for your support.

1. Please provide full device details.

1.1. Device name: Stratix III

1.2. Full part number: EP3SL70F780C4NAB

[CTH] Herewith below full device marking information.

SN: 11S00E7972YL11UE91M152

Marking: ALTERA

EP3SL70F780C4NAB

J CAFA71901A

KOREA

S848AFAZ

361JA8X0C

SN: 11S00E7972YL11UE91M121

Marking: ALTERA

EP3SL70F780C4NAB

J CAFA71901A

KOREA

S848AFAZ

361JA8X0C

SN: 11S00E7972YL11UE91M147

Marking: ALTERA

EP3SL70F780C4NAB

J CAFA71901A

KOREA

S848AFAZ

361JA8X0C

2. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.

[CTH] 13889 DPPM [Failed 3 out of 216 units]

3. What is the failure symptom? Please elaborate the failure symptom in detail.

[CTH] The failure symptom is FPGA Power +3.3VE Load to GND.

4. When did the failure happen? How did you discover the failure?

[CTH] Found Stratix® III Devices Failure [MFG PN: EP3SL70F780C4NAB] Failure during ICT [In-Circuit Test].

To confirmed failure through test step debug and can be duplicated failure with FPGA Power +3.3VE Load to GND.

Once replaced known good FPGA and re-tested to confirm the failure then its passed.

5. How did you determine the failure? Please elaborate the procedures.

Step1: Visual inspection board

Result : no any defect found

Step2: Verify by digital multimeter at +3.3VE To GND.

Result : Failed. Measure= 5 ohms, normally =~592 ohms. This compare with the good board.

Step3: Send Board to rework remove BGA Location UFPGA2 for confirm between pad pcb or UFPGA2

Result: Load in component (replace new part UFPGA2)

Step4: Confirm the board and component by send to re-test ICT [In-Circuit Test].

Result: Pass

6. Does the failure unit ever working before failure?

[CTH] Yes

7. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.

[CTH] No any deviate solder re-flow temperature profiles and moisture sensitivity. The re-flow temperature profiles need to get approve from customer. Will keep you post update.

8. Did you swap the failure device to a known good board? Is the failure following the device or board?

[CTH] No. BUT Once replaced known good FPGA Units and re-tested to confirm the failure then board can have passed.