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JDocl's avatar
JDocl
Icon for New Contributor rankNew Contributor
6 years ago

Hi Intel, I am researching for the device LE82GME965 SLA9F and i cannot find the baking condition of the part. Could you advise the baking condition (temp and time).

Also, i believe the baking condition is based on package thickness, am i correct? Hope to hear from you soon. Thank you!
Deshi_Intel's avatar
Deshi_Intel
Icon for Regular Contributor rankRegular Contributor
6 years ago

Hi,

Thanks for your understanding.

I will now set this case to closure.

Thanks.

Regards,

Intel FPGA Support Agent