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JDocl's avatar
JDocl
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6 years ago

Hi Intel, I am researching for the device LE82GME965 SLA9F and i cannot find the baking condition of the part. Could you advise the baking condition (temp and time).

Also, i believe the baking condition is based on package thickness, am i correct? Hope to hear from you soon. Thank you!
JDocl's avatar
JDocl
Icon for New Contributor rankNew Contributor
6 years ago

Understood... I have placed my inquiry under graphics. Thank you again and you can delete this case now.