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JDocl's avatar
JDocl
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6 years ago

Hi Intel, I am researching for the device LE82GME965 SLA9F and i cannot find the baking condition of the part. Could you advise the baking condition (temp and time).

Also, i believe the baking condition is based on package thickness, am i correct? Hope to hear from you soon. Thank you!
JDocl's avatar
JDocl
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6 years ago

Hi Intel FPGA Team,

Noted and thank you... Could you please advise which category is for the device i am looking for? 82GME965 Chipset