Forum Discussion

JDocl's avatar
JDocl
Icon for New Contributor rankNew Contributor
6 years ago

Hi Intel, I am researching for the device LE82GME965 SLA9F and i cannot find the baking condition of the part. Could you advise the baking condition (temp and time).

Also, i believe the baking condition is based on package thickness, am i correct? Hope to hear from you soon. Thank you!
Deshi_Intel's avatar
Deshi_Intel
Icon for Regular Contributor rankRegular Contributor
6 years ago

Hi,

I think you might have posted this thread into the wrong community forum. This forum only covers Intel FPGA product. Our agents can only help to provide assistance with regards to FPGA product. If you have further enquiries on other Intel product, please post your question to the correct Intel Community topics from the link below:

https://forums.intel.com/s/

We will then require deleting this thread from the Intel FPGA forum topic.

Thank you.

Regards,

Intel FPGA Support Team