Hello, Can you please supply he MAX Reflow Temp for this Part EPM2210F324I5 with a TIN LEAD finish , we have a TEMP restriction of 220 MAX for the Profile due to the fact that we have other BGA's on the board that have a SAC405

This Device from Intel ​ has Tin Lead Plating. we also have other parts on the Board that are Pb free , It may not be recommended but this is what we have and we need to developed a Reflow Profile that will be ale to satisfy these conditions of having a PB Free parts and having Tin Pb parts. The issue is this INTEL part that I am asking about , your material says Peak Reflow of 220 C, this creates an issue since the Profile that we need has to be at least 219 C to accommodate the PB free part. What I am asking is if the 220 C is a recommended Peak reflow or can you be slightly over , possibly 1 or 2 degrees over.