Win cash prizes in this year’s environmentally friendly, cloud connected InnovateFPGA design contest
InnovateFPGA contest sponsors – Terasic, Intel, Microsoft, Analog Devices, Arrow, Digi-Key, Mouser Electronics, and Macnica – invite ecologically minded teams to enter this year’s design contest to win cash prizes, medals, and fame. Competing teams will use the Terasic DE10-Nano FPGA Cloud Connectivity Kit with Analog Devices plug-in cards and IoT cloud connections provided by Microsoft Azure Cloud Services to create design solutions that help to reduce the environmental impact and the demands that we place on the Earth’s resources. All submitted projects must be based on and make complete use of the Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit. The Terasic DE10-Nano FPGA Cloud Connectivity Kit with an Analog Devices plug-in card and credits/limited-time access to Microsoft’s Azure Cloud Services will be provided at no cost to selected participating teams. Contest teams will demo their designs at regional finals and at the Grand Finale, to be held in San Jose, California on June 23, 2022. Click here for more information and to enter the InnovateFPGA contest. Technical proposals are due by September 30, 2021. For full contest rules, click here. Get details on the Terasic DE10-Nano FPGA Cloud Connectivity Kit by clicking here. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
Enter the InnovateFPGA Contest to Create Needed Solutions for Real-World, Funded Projects
The Global Environment Facility Small Grants Programme (GEF SGP), implemented by the United Nations Development Programme, is collaborating with the InnovateFPGA contest. Showcase your skills with Intel Edge-Centric FPGAs and help develop technical solutions that reduce environmental impact. The SGP team is leading 7 funded projects requiring solutions in biodiversity, sustainable agriculture, and marine conservation. The Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit together with Analog Devices plug-in boards and Microsoft Azure IoT are the perfect platform for you to apply your know-how to solve important real-world problems. If you are successful, your project could be deployed by the local conservation organization, and you could win cash prizes and recognition! Learn more about SGP Projects and enter the InnovateFPGA contest here. Technical proposals are due by October 31, 2021. For full contest rules, click here. Get details on the FPGA Cloud Connectivity Kit as well as Analog Devices Plug-in boards and Microsoft Azure IoT by clicking here. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.Full-day virtual event discusses embedded edge processing using EXOR’s tiny GigaSOM, based on a multicore Intel® Atom® SoC and an Intel® Cyclone® 10 FPGA
EXOR Embedded, Intel, and Arrow are conducting a full-day, online event on July 21 to familiarize you with the EXOR GigaSOM gS01, a small system on module (SOM) measuring 81.6 x 54 mm (3.2 x 2.1 inches), that combines the processing capabilities of a multicore Intel® Atom® SoC with an Intel® Cyclone® 10 GX FPGA. The EXOR GigaSOM is available with 2- or 4-core Intel Atom processors, either 85K or 220K logic elements in the Intel Cyclone 10 GX FPGA, as much as 8 Gbytes of LPDDR4 SDRAM dedicated to the Intel Atom processor and as much as 2 GBytes of DDR3 SDRAM for the FPGA. That’s a lot of embedded processing capability in a fairly compact package. The EXOR GigaSOM also bristles with interconnect capability including six USB 2.0 ports; two USB 3.0 ports; two SATA3 ports; a Gigabit Ethernet port; two PCIe ports; and a collection of I2C, SPI, CAN, and UART ports. Both Linux and Android BSPs are available for the EXOR GigaSOM. The day-long virtual event being held on July 21 consists of three Webinars, including one dedicated to the EXOR GigaSOM and its use for embedded edge, IIoT, and Industry 4.0 projects. The virtual event starts at 9 am CET (Central European Time). Click here for more information and to register for the event. Intel’s silicon and software portfolio empowers our customers’ intelligent services from the cloud to the edge. Notices & Disclaimers Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.Free Functional-Safety Webinar: Discover How FPGAs Can Accelerate Your Safety Critical Application Development
Arrow and Intel are presenting a free Webinar that will introduce you to functional-safety design concepts and the reasons you will want put FPGAs at the heart of IEC 61508 compliant safe systems. The Webinar will also provide an in-depth look at the components of Intel's FPGA Functional Safety Data Pack and how the package can help shorten IEC 61508 project development time and reduce certification risks for safety-critical industrial applications such as industrial servo and inverter drives, safety devices, and automation controllers. You will also learn about opportunities for additional functional-safety training and other related safety-critical design information available from Intel. The Webinar will be conducted by Dr. Mark Jervis, Industrial and Automotive System Architect at Intel. It’s being held on Monday, August 17, but if you can’t make that date, register anyway and you will receive a Web link so that you can watch the Webinar at your convenience after the live event. Register here. For more information on the IEC-61508 certified Intel Functional Safety Data Package, click here. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.