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The TI 74CBTD3384C
http://www.ti.com/lit/ds/symlink/sn74cbtd3384c.pdf buffers used on the MAX II PCI development kit are bus-switches with the diode internal to the device. You can power them from 5V and they'll clamp bidirectional signals to 3.3V levels.
I've used a bunch a bus switches on lots of designs, but never realized they had parts with the diodes internal to the devices.
Cheers,
Dave
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Thanks Dave for your help.
I would certainly prefer something with less external parts required.
I sampled these today from TI, although they only had the DBQ(SSOP/QSOP) parts available. I prefer SOIC with the larger 1.27mm pitch. I've soldered the SOIC before, and they weren't bad. The SSOP have half the pitch.
Any experience hand soldering these?
Thanks,
Keith