Hello, Can you please supply he MAX Reflow Temp for this Part EPM2210F324I5 with a TIN LEAD finish , we have a TEMP restriction of 220 MAX for the Profile due to the fact that we have other BGA's on the board that have a SAC405

​Hello Aim, I have looked at the information that you have sent. For My part , it references to have a Peak Reflow Temperature of 220C it is a 19 x 19 x 1.8 FPBGA part Number EPM2210F324I5 with a TIN LEAD finish . My question is How can you have that exact same package and have it with Pb_Free Balls and have a Peak Reflow Temp of 250C? I also see that the Note on the Bottom of the Table says that the Classification Temperature is +/- 2 C, would that mean that the Peak reflow Temp could be as high as 222 and as low as 218? Also , is that Peak Reflow Temp a recommended , I have to run this PART a bit higher due to a SAC045 BGA, I need to be at least 221, for this part, will that be OK?