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Re: Altera parts package FC-FBGA are vented or not vented
Hello AqidAyman, I am really sorry for not responding your answer. But I am getting conflicting information about 5AGXMA3D4F27I3G is Arria-V device and it is a G part. Some one from Intel (Kozak, Ali <ali.kozak@intel.com>) sent the e-mail that this part is Vented. And your response was Not-Vented. So I was digging in to this information. One document I found it says " All lidless flip chip and wire bond packages are non-vented package. All other flip chip packages are vented package." So my confusion is which category this parts fall into? Please advise. Thank you so much for keep supporting us. Mukesh Tataria2.7KViews0likes0CommentsAltera parts package FC-FBGA are vented or not vented
Hello, We are using following parts. DPN Description Source MPN Source MFR Supplier Package MCKT,DGTL,ASIC;FPGA,UNALTERED 5AGXMA3D4F27I3G ALTERA CORP FC-FBGA MCKT,DGTL,ASIC;FPGA,780PINS 10AX022E3F29I2LG ALTERA CORP FC-FBGA MCKT,DGTL,ASIC;FPGA,1152PINS 10AX115H1F34I1SG ALTERA CORP FC-FBGA We have some concern about Some BGA packages are not hermetically sealed, and exposure to cleaning solvents or excessive moisture during board assembly can pose serious package reliability concerns. Small vents are placed by design between the heatspreader (lid) and the organic substrate to allow for outgassing and moisture evaporation. So we like to know if all the above parts packages are Vented or not vented. So we can take extra care to prevent the damages. Please let me know. Thank you so much for your time and support.Solved2.9KViews0likes7Comments