ContributionsMost RecentMost LikesSolutionsRe: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, Do you have a result now? These 2 parts are lisence parts so they need to be returned backt to MFG for scrap. But flex will do no deduction. Regards Brian Re: FPGA MAX Reflow Temperature Issue Hi Aiman, The AN353 is a recommended data according to IPC standard. Our purpose is to seek INTEL's help to confirm if the max reflow temp marked on the label is right or not. please refer to the attached label. It's quite urgent for flex production, please help to verify. Regards Brian Re: FPGA MAX Reflow Temperature Issue Hi Aiman, We still can't find the max reflow temperature according to the link you provided, can you help to confirm if the max reflow temperature is 245 ℃? Regards, Brian Re: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, Do you have any update? Brian FPGA MAX Reflow Temperature Issue Hi Intel Team It's urgent. Pls help to confirm (MPN: EP3SE110F1152C2G) FPGA MAX Reflow Temperature Issue, material label shown us the max reflow temperature is 245 ℃,is it right? Can you send me the mail to confirm? My mail address is Brian.Sun@flex.com BRs Brian SolvedRe: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, Thanks for your support, I'll be waiting for your reply. PS: Can we contact via E-mail? BRs Brian Re: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, sorry, correct the distributor "Arrow Asia Distribution limitedA" My contact window is SIMMY TSE <SIMMY.TSE@arrowasia.com>. Can you contact me via mail? My mail address is Brian.Sun@flex.com Re: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, sorry, correct the distributor "Arrow Asia Distribution limitedA" My contact window is SIMMY TSE <SIMMY.TSE@arrowasia.com>. Can you contact me via mail? My mail address is Brian.Sun@flex.com Re: Lisence parts that need to be returned back to Intel for scrapping Hi Wani, Our distributor is Arrow Electronics. My contact window is SIMMY TSE <SIMMY.TSE@arrowasia.com>. Can you help to provide your mail address? So that I could push both of you into the loop. BRs Brian Re: Lisence parts that need to be returned back to Intel for scrapping Hi Andrew, Our production need to scrap them but these materials must be returned back to MFG for scrapping due to license part policy. Can you help to contact me via Mail on this issue? I appreciate it for your kind help. Mail Adress: Brian.Sun@flex.com