Addressing the Greatest Memory and Compute Challenges with Intel® Agilex™ M-Series FPGAs
We are enabling our customers to achieve higher performance with better power efficiency across all end markets and applications with our flagship Intel® Agilex™ FPGA family. We continue to build the momentum, with the Intel® Agilex™ M-Series family variant.
We Hope to See You at Intel® FPGA Technology Day 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is “Accelerating a Smart and Connected World.” This virtual event will showcase Intel® FPGAs, SmartNICs, and infrastructure processing units (IPUs) through webinars and demonstrations presented by Intel experts and partners. The sessions are designed to be of value for a wide range of audiences, including Technology Managers, Product Managers, Board Designers, and C-Level Executives. Attendees to this four-day event will learn how Intel’s solutions can solve the toughest design challenges and provide the flexibility to adapt to the needs of today’s rapidly evolving markets. A full schedule of Cloud, Networking, Embedded, and Product Technology sessions, each just 30 minutes long, will enable you to build the best agenda for your needs. Day 1 (December 6), TECHNOLOGY: FPGAs for a Dynamic Data Centric World: Advances in cloud infrastructure, networking, and computing at the edge are accelerating. Flexibility is key to keeping pace with this transforming world. Learn about innovations developed and launched in 2021 along with new Intel FPGA technologies that address key market transitions. Day 2 (December 7), CLOUD AND ENTERPRISE: Data Center Acceleration: The cloud is changing. Disaggregation improves data center performance and scalability but requires new tools to keep things optimized. Intel FPGA smart infrastructure enables smarter applications to make the internet go fast! Day 3 (December 8): EMBEDDED: Transformation at the Edge: As performance and latency continue to dictate compute’s migration to the edge, Intel FPGAs provide the workload consolidation and optimization required with software defined solutions enabled by a vast and growing partner ecosystem. Day 4 (December 9): NETWORKING: 5G – The Need for End-to-End Programmability: The evolution of 5G continues to push the performance-to-power envelop, requiring market leaders to adapt or be replaced. Solutions for 5G and beyond will require scalable and programmable portfolios to meet evolving standards and use cases. To explore the detailed program, see the featured speakers, and register for the North America event, Click Here. Register in other regions below: EMEA China Japan Asia Pacific
Upcoming Webinar: Computational Storage Acceleration Using Intel® Agilex™ FPGAs
Today’s computational workloads are larger, more complex, and more diverse than ever before. The explosion of applications such as high-performance computing (HPC), artificial intelligence (AI), machine vision, analytics, and other specialized tasks is driving the exponential growth of data. At the same time, the trend towards using virtualized servers, storage, and network connections means that workloads are growing in scale and complexity. Traditionally, data is conveyed to a computational engine -- such as a central processing unit (CPU) -- for processing, but transporting the data takes time, consumes power, and is increasingly proving to be a bottleneck in the overall process. The solution is computational storage, also known as in-storage processing (ISP). The idea here is that, instead of bringing the data to the computational engine, computational storage brings the computational engine to the data. In turn, this allows the data to be processed and analyzed where it is generated and stored. To learn more on this concept, please join us for a webinar led by Sean Lundy from Eideticom, Craig Petrie from BittWare, and myself: Computational Storage Using Intel® Agilex™ FPGAs: Bringing Acceleration Closer to Data The webinar will take place on Thursday 11 November 2021 starting at 11:00 a.m. EST. Sean will introduce Eideticom’s NoLoad computational storage technology for use in data center storage and compute applications. NoLoad technology provides CPU offload for applications, resulting in the dramatic acceleration of compute-plus-data intensive tasks like storage workloads, data bases, AI inferencing, and data analytics. NoLoad’s NVMe-compliant interface simplifies the deployment of computational offload by making it straightforward to deploy in servers of all types and across all major operating systems. Craig will introduce BittWare’s new IA-220-U2 FPGA-based Computational Storage Processor (CSP) that supports Eideticom’s NoLoad technology as an option. The IA-220-U2 CSP, which is powered by an Intel Agilex F-Series FPGA with 1.4M logic elements (LEs), features PCIe Gen 4 for twice the bandwidth offered by PCIe Gen 3 solutions. This CSP works alongside traditional Flash SSDs, providing accelerated computational storage services (CSS) by performing compute-intensive tasks, including compression and/or encryption. This allows users to build out their storage using standard SSDs instead of being locked into a single vendor’s storage solutions. BittWare’s IA-220-U2 accelerates NVMe FLASH SSDs by sitting alongside them as another U.2 Module. (Image source: Bittware) We will also discuss the Intel Agilex™ FPGAs that power BittWare’s new CSP. Built on Intel’s 10nm SuperFin Technology, these devices leverage heterogeneous 3D system-in-package (SiP) technology. Agilex I-Series FPGAs and SoC FPGAs are optimized for bandwidth-intensive applications that require high-performance processor interfaces, such as PCIe Gen 5 and Compute Express Link (CXL). Meanwhile, Agilex F-Series FPGAs and SoC FPGAs are optimized for applications in data center, networking, and edge computing. With transceiver support up to 58 Gbps, advanced DSP capabilities, and PCIe Gen 4 x16, the Agilex F-Series FPGAs that power BittWare’s new CSP provide the customized connectivity and acceleration required by compute-plus-data intensive power sensitive applications such as HPC, AI, machine vision, and analytics. This webinar will be of interest to anyone involved with these highly complex applications and environments. We hope to see you there, so Register Now before all the good virtual seats are taken.Enter the InnovateFPGA Contest to Create Needed Solutions for Real-World, Funded Projects
The Global Environment Facility Small Grants Programme (GEF SGP), implemented by the United Nations Development Programme, is collaborating with the InnovateFPGA contest. Showcase your skills with Intel Edge-Centric FPGAs and help develop technical solutions that reduce environmental impact. The SGP team is leading 7 funded projects requiring solutions in biodiversity, sustainable agriculture, and marine conservation. The Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit together with Analog Devices plug-in boards and Microsoft Azure IoT are the perfect platform for you to apply your know-how to solve important real-world problems. If you are successful, your project could be deployed by the local conservation organization, and you could win cash prizes and recognition! Learn more about SGP Projects and enter the InnovateFPGA contest here. Technical proposals are due by October 31, 2021. For full contest rules, click here. Get details on the FPGA Cloud Connectivity Kit as well as Analog Devices Plug-in boards and Microsoft Azure IoT by clicking here. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
Win cash prizes in this year’s environmentally friendly, cloud connected InnovateFPGA design contest
InnovateFPGA contest sponsors – Terasic, Intel, Microsoft, Analog Devices, Arrow, Digi-Key, Mouser Electronics, and Macnica – invite ecologically minded teams to enter this year’s design contest to win cash prizes, medals, and fame. Competing teams will use the Terasic DE10-Nano FPGA Cloud Connectivity Kit with Analog Devices plug-in cards and IoT cloud connections provided by Microsoft Azure Cloud Services to create design solutions that help to reduce the environmental impact and the demands that we place on the Earth’s resources. All submitted projects must be based on and make complete use of the Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit. The Terasic DE10-Nano FPGA Cloud Connectivity Kit with an Analog Devices plug-in card and credits/limited-time access to Microsoft’s Azure Cloud Services will be provided at no cost to selected participating teams. Contest teams will demo their designs at regional finals and at the Grand Finale, to be held in San Jose, California on June 23, 2022. Click here for more information and to enter the InnovateFPGA contest. Technical proposals are due by September 30, 2021. For full contest rules, click here. Get details on the Terasic DE10-Nano FPGA Cloud Connectivity Kit by clicking here. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.FPGA Cloud Connectivity Kit gets you from the Edge to Microsoft Azure IoT quickly
A new FPGA Cloud Connectivity Kit developed by Terasic and Intel and based on the Intel® Cyclone® V SoC FPGA can get you from raw sensor data on the edge to Microsoft Azure IoT in the cloud quickly, with simple tools, simple templates, and open source design examples. Microsoft Azure IoT allows you to connect, monitor, and control billions of devices with speed and simplicity on a fully managed application platform. The FPGA Cloud Connectivity Kit coupled with Microsoft Azure IoT allows you to meet tight market windows by developing smart, connected IoT designs that quickly integrate into the cloud. FPGAs bring several critical characteristics to IoT design including: Connectivity Deterministic Compute Safety Hardware-Level Flexibility Data Security Industrial-Grade Use Conditions Reliability Long Product Life Cycles There’s a free, four-module tutorial for this kit titled “Build, Deploy, and Manage your FPGA-Based IoT Edge Applications using Microsoft Azure” in the Intel Developer Zone. This step-by-step tutorial takes you through the process of connecting an FPGA-based edge device to the cloud, where edge data can be turned into actionable knowledge either by people or by AI. More in-depth information about the FPGA Cloud Connectivity Kit is available in a 14-minute YouTube video titled “Build, Deploy and Manage Your FPGA-based IoT Edge Applications.” The FPGA Cloud Connectivity Kit is available now from Mouser Electronics for $189. Click here for details. Notices and Disclaimers Intel technologies may require enabled hardware, software or service activation. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. No product or component can be absolutely secure. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.IEEE FPGA Workshops and Tutorials featuring Intel speakers, May 9-13
The virtual 29th IEEE International Symposium On Field-Programmable Custom Computing Machines (FCCM) takes place online from May 9-12. Intel speakers will be presenting several workshops and tutorials at this conference including: Intel FPGA Cloud Services and Remote Learning – Workshop – May 9 AI Optimized Intel® Stratix® 10 NX FPGA – Tutorial – May 12 Using Intel® oneAPI Toolkits with FPGAs – Workshop – May 12 For more information about these IEEE FCCM workshops and tutorials including registration details, click here. Notices and Disclaimers Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.How Exor International forged an Industry 4.0 Edge and Cloud Infrastructure out of more than 200 industrial automation protocols
By Exor International Exor International provides products and services that support the growing need for intelligence in industrial automation markets during the rapid, ongoing digital transformation and streamlining of nearly every industrial process in nearly every factory on the planet. The benefits of this transformation include: Reduced energy consumption Increased productivity and throughput Improved production quality Higher reliability levels and better uptime This market requires specialized products and services tailored to the real-time nature of the industrial automation business and Exor strives to meet those requirements with products closely adapted to those needs. Two significant examples include: The Exor Industrial Smart Edge Platform used for implementing smart Human-Machine Interfaces (HMI) and HMI/controllers, edge controllers, and multiprotocol field gateways for industrial IoT (IIoT) networks The Corvina Cloud and Corvina Edge used for implementing network architectures optimized for industrial applications The Exor Industrial Smart Edge Platform employs Intel® Cyclone® V SoC FPGAs to bring a combination of real-time Linux and high-speed, FPGA-based response times to bring real-time response capabilities and secure, enterprise-class network connectivity to existing applications using more than 200 legacy industrial automation protocols. The continually evolving Industrial Smart Edge Platform incorporates an RTOS running on the Intel SoC FPGA’s internal multicore processor and implements EtherCAT functionality. It is extremely difficult to implement the real-time aspects of EtherCAT without an FPGA or other dedicated hardware to execute time-critical portions of the protocol. Similarly, the increasingly popular Time Sensitive Networking (TSN) protocol also requires the capabilities of an FPGA’s programmable logic to meet real-time protocol specifications. Further, the TSN specifications are still in development, they are still in flux, so an FPGA’s reprogrammability is extremely helpful for today’s TSN implementations. Exor’s Corvina Cloud and Corvina Edge IIoT networking platform allows the data generated by new or legacy products, plants, systems, and machines to be collected, processed, and analyzed to bring industry 4.0 benefits including asset performance management, predictive maintenance, and operational technology (OT) remote monitoring to a wide range industrial processes. Exor designed the Corvina Cloud and Corvina Edge Cluster with a solid infrastructure that permits automatic procedures to constantly monitor system state and to predict and warn of any detected issues. For example, an automatic object inspection (AOI) system might need to use a variety of equipment including linear cameras, colorimeters, image photometers, surface-brightness measurement sensors, contrast TFT measurement sensors, and other instruments to perform complex inspections of manufactured goods or even farm produce. Such an integrated system can perform inspections for surface uniformity, scratches, and blob or printing defects and can detect particles, fingerprints, contamination, or non-uniform surfaces. Each of these sensors generally employs different interface protocols and data formats. All of these can be handled by the Corvina platform and Corvina Edge devices. To help ensure overall network reliability, Exor has built a redundancy capability into its Corvina products. Corvina Edge devices can be twinned. If a Corvina Edge device operating as the primary unit in a twin configuration stops working, the twin secondary device can take over until the failed device can be replaced. The result is uninterrupted factory output. Exor’s gigaSOM platform is the computing element that implements a Corvina Edge node. The Exor gigaSOM teams a multicore Intel® Atom® E3930, E3940, or E3950 processor with an Intel® Cyclone® 10 FPGA. The Intel Cyclone 10 FPGA addresses the real-time needs of industrial automation requirements and the Intel Atom processor opens the door to a wide range of Intel-developed software that Exor has used for its own product development including: Edge Insights for Industrial Orchestrator (code named Castle Lake): A set of pre-integrated ingredients designed to accelerate the development and deployment of industrial solutions. The package is designed to be deployed on an edge device closest to data generation such as the tool or machine assembling a product. This package enables the ingestion of video and time-series data, storage of data, and data analysis for closed-loop control and networked reporting. Edge Control for Industrial (ECI): A suite of BitBake (make-build) recipes that can build custom real-time operating systems with virtualization capabilities, integrated industrial protocol support, CPU and kernel optimizations, and benchmarking tools for real-time applications. Edge Insights Software (EIS): An open, modular, and validated software package that ingests, processed, and stores time series data – such as image, video, or audio data – so that it can be subsequently processed by data analytics running in edge devices or in the cloud. Wireless TSN (WTSN): Provides time synchronization and time-aware traffic scheduling and shaping to create a low-latency, time-sensitive wireless network using WiFi 5 and WiFi 6 networks. WebAssembly (WASM) and SoftPLC: A reference kit that serves as a programmable automation controller (PAC) prototyping tool using a provided runtime engine and a WebAssembly Micro Runtime (WAMR). Open Network Services Software (OpenNESS): An open-source software toolkit that enables easy orchestration and management of edge services across diverse network platforms in multi-cloud environments. Coreboot: A firmware platform that provides fast and secure boot capabilities for embedded platforms. In addition, Intel and its strategic IP partners offer a broad portfolio of configurable IP cores that are optimized for Intel® FPGAs. These many cores allow us to shrink development time by reusing proven, existing cores in our designs. We need only develop cores that are specific to our own requirements. Intel also provides FPGA-specific IP, such as the AI Deep Learning Acceleration (DLA) suite, which we expect to harness in future product revisions. Exor has benefitted from Intel’s help in many more ways that just the availability of an immense software and IP library and infrastructure. Intel continues to evolve its processor and FPGA products by constantly introducing more advanced semiconductor products, which allows Exor to do the same with its system-level industrial offerings. In addition, Intel has provided engineering and prompt technical support on an almost daily basis, which has been of tremendous help to Exor’s design team. Intel’s sales team has offered our solutions to its customers and has connected interested clients and partners to us. Exor and Intel have commonly promoted solutions at trade fairs and virtual events. As a result, we have already established important cooperative relationships with Intel’s partners and throughout the broader Intel ecosystem. For more information about Exor International and its products, click here or contact Exor International directly. Notices & Disclaimers Intel technologies may require enabled hardware, software or service activation. Code names are used by Intel to identify products, technologies, or services that are in development and not publicly available. These are not "commercial" names and not intended to function as trademarks. No product or component can be absolutely secure. Your costs and results may vary. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy. © Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
