Which type of 256-pin ball-grid array (BGA) package is used for the MAX® EPM7512AE and EPM7512B devices?

Description

The packaging data sheet shows two package dimensions for the 256-pin BGA:

- 256-pin thermally enhanced BGA cavity down
- 256-pin non-thermally enhanced BGA cavity up

Both MAX EPM7512AE and EPM7512B devices use the 256-pin thermally enhanced BGA cavity down.

Note: The only physical dimension that differs between the two packages is the package height. All other dimensions are identical.