What is the solder stencil aperture opening of Altera BGA devices?

Description

The solder stencil aperture opening can be derived from the Ball Grid Array (BGA) pad pitch and the BGA pad opening specifications of your target Altera® device.

The BGA pad pitch for Altera devices can be found from the Packaging Specifications and Dimensions web page, and the BGA pad opening can be found in AN114 : Designing With High-Density BGA Packages for Altera Devices (PDF)