Knowledge Base Article

How much can I expect the solder balls of a BGA package to shrink after reflow?

Description

You can expect the solder balls of a BGA package to shrink by about a third after reflow.

For example, if the solder balls have a height of 0.3mm before reflow, they will shrink to a height of about 0.2mm after reflow.

Updated 3 months ago
Version 2.0
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